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Composition for encapsulation film, encapsulation

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专利名称:Composition for encapsulation film,

encapsulation film, and electronic devicecomprising the same

发明人:Jung Sup Shim,Yoon Gyung Cho,Suk Ky

Chang,Hyun Jee Yoo,Seung Min Lee,KyungYul Bae

申请号:US149978申请日:20140618公开号:US09768386B2公开日:20170919

摘要:There are provided a composition for encapsulation film, an encapsulation film,and an electronic device having the same. The present application may provide anencapsulation film having an excellent moisture barrier property, operability, workability,and durability and a structure including an element encapsulated by the encapsulationfilm.

申请人:LG CHEM, LTD.

地址:Seoul KR

国籍:KR

代理机构:Dentons US LLP

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