ASSEMBLY FOR MOUNTING ELECTRONIC COMPONENTS, METHO

专利名称：ASSEMBLY FOR MOUNTING ELECTRONIC

COMPONENTS, METHODS OF USE ANDMANUFACTURE THEREOF

发明人：Chi H. Wu,Liu C. Lei,Thomas J. Socci,Douglas

Nobbs,George R. Watchko

申请号：US11828467申请日：20070726

公开号：US20080025813A1公开日：20080131

专利附图：

摘要：An assembly for mounting electronic components includes a face plate

comprising a thermoplastic material. The face plate includes a retaining element forsecuring a captive screw and spring assembly for mounting an electronic printed circuitboard. The retaining element includes one or more slots adapted to expand the elementto permit insertion of the screw and deformation of the hole upon insertion of the screw,while locking the screw to retain the screw in place. This arrangement permits theelimination of the metal standoff frequently used in similar devices. Methods forpreparing the assembly and mounting the printed circuit boards are also described.

申请人：Chi H. Wu,Liu C. Lei,Thomas J. Socci,Douglas Nobbs,George R. Watchko

地址：Quincy MA US,ZhaBei Dist. CN,Fairport NY US,Dover NH US,Stoneham MA US

国籍：US,CN,US,US,US

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