METHOD FOR INJECTION COMPRESSION MOLDING OF CONDUC

专利名称：METHOD FOR INJECTION COMPRESSION

MOLDING OF CONDUCTIVE

THERMOPLASTIC RESIN COMPOSITION

发明人：TANAKA, Takayoshi,IGA, Toru,AE, Haruhiko申请号：EP05730433.9申请日：20050413公开号：EP1736295A1公开日：20061227

专利附图：

摘要：An injection/compression molding method comprising the steps of: a injectionfilling step for injection filling a conductive thermoplastic resin composition containing a

conductive filler at a ratio of 70 to 95 mass% into a cavity space 13 with the interval in therange of 0.5 to 5.0 mm formed by mating faces 11a, 12a of dies 11, 12 each having atemperature in the range of 150 to 250 °C; and a compression forming step forcompression forming, after the filling step is finished and the die space was closed, theconductive thermoplastic resin composition filled in said space at the compression speedin the range of 1.0 to 20 mm/sec with the compression pressure of 10 MPa or higher. Asobtained molded product contains the conductive filler homogeneously distributed at ahigh content ratio, so that the molded product can be applied to, for instance, aseparator for a fuel cell.

申请人：IDEMITSU KOSAN CO., LTD.

地址：1-1, Marunouchi 3-chome, Chiyoda-ku Tokyo 100-8321 JP

国籍：JP

代理机构：Gille Hrabal Struck Neidlein Prop Roos

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