您好,欢迎来到划驼旅游。
搜索
您的当前位置:首页METHOD FOR INJECTION COMPRESSION MOLDING OF CONDUC

METHOD FOR INJECTION COMPRESSION MOLDING OF CONDUC

来源:划驼旅游
专利内容由知识产权出版社提供

专利名称:METHOD FOR INJECTION COMPRESSION

MOLDING OF CONDUCTIVE

THERMOPLASTIC RESIN COMPOSITION

发明人:TANAKA, Takayoshi,IGA, Toru,AE, Haruhiko申请号:EP05730433.9申请日:20050413公开号:EP1736295A1公开日:20061227

专利附图:

摘要:An injection/compression molding method comprising the steps of: a injectionfilling step for injection filling a conductive thermoplastic resin composition containing a

conductive filler at a ratio of 70 to 95 mass% into a cavity space 13 with the interval in therange of 0.5 to 5.0 mm formed by mating faces 11a, 12a of dies 11, 12 each having atemperature in the range of 150 to 250 °C; and a compression forming step forcompression forming, after the filling step is finished and the die space was closed, theconductive thermoplastic resin composition filled in said space at the compression speedin the range of 1.0 to 20 mm/sec with the compression pressure of 10 MPa or higher. Asobtained molded product contains the conductive filler homogeneously distributed at ahigh content ratio, so that the molded product can be applied to, for instance, aseparator for a fuel cell.

申请人:IDEMITSU KOSAN CO., LTD.

地址:1-1, Marunouchi 3-chome, Chiyoda-ku Tokyo 100-8321 JP

国籍:JP

代理机构:Gille Hrabal Struck Neidlein Prop Roos

更多信息请下载全文后查看

因篇幅问题不能全部显示,请点此查看更多更全内容

Copyright © 2019- huatuo6.com 版权所有 湘ICP备2023023988号-11

违法及侵权请联系:TEL:199 1889 7713 E-MAIL:2724546146@qq.com

本站由北京市万商天勤律师事务所王兴未律师提供法律服务