ELECTRICAL INTERCONNECT ASSEMBLY

专利名称：ELECTRICAL INTERCONNECT ASSEMBLY发明人：Wei Kuong FOONG,Kok Sing GOH,Shamal

MUNDIYATH,Eng Kiat LEE

申请号：US14609076申请日：20150129

公开号：US20150212111A1公开日：20150730

专利附图：

摘要：An electrical test contact electrically connects a test terminal of an IntegratedCircuit (IC) test assembly with an IC terminal of an IC device in an electrical interconnectassembly. The test contact is formed of electrically conductive material and includes a

head portion and a foot portion. The head portion includes a first electrical contactingportion for electrically engaging an IC terminal of an IC device during use, and the footportion includes a second electrical contacting portion for electrically engaging a testterminal of a test assembly during use. The head portion includes a head receivingportion that receives a first resiliently biasing member to retain the first resilientlybiasing member in contact with the test contact. The first resiliently biasing memberbiases the first electrical contacting portion against the IC terminal of the IC deviceduring use. An electrical interconnect assembly having multiple test contacts is alsodisclosed.

申请人：JF MICROTECHNOLOGY SDN. BHD.

地址：Petaling Jaya MY

国籍：MY

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