Packaging structure

专利名称：Packaging structure发明人：Sumihiro Ichikawa申请号：US15202700申请日：20160706公开号：US09824993B2公开日：20171121

专利附图：

摘要：A packaging structure includes a first substrate including a first metal terminaland a first protruding resin portion formed at a first surface; a second substrate includinga second metal terminal and a second protruding resin portion formed at a secondsurface, the second metal terminal being made of the same kind of metal as the first

metal terminal; and a sealing portion filled between the first surface of the first substrateand the second surface of the second substrate, the first metal terminal and the secondmetal terminal being directly bonded with each other, the first protruding resin portionand the second protruding resin portion being directly bonded with each other, each ofthe first protruding resin portion and the second protruding resin portion being made ofa resin material that does not include fillers, and the sealing portion being made of aresin material including fillers.

申请人：SHINKO ELECTRIC INDUSTRIES CO., LTD.

地址：Nagano JP

国籍：JP

代理机构：IPUSA, PLLC

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