专利名称：Electronic component and electronic unit发明人：Happoya, Akihiko,Suzuki, Daigo申请号：EP151294.1申请日：20150209公开号：EP2980865A2公开日：20160203
专利附图：
摘要：According to one embodiment, an electronic component includes a metalportion (12a), a mold resin (13) covering at least a part of the metal portion (12a), and amolecular adhesion layer (15) provided between a surface of the metal portion (12a) andthe mold resin (13).
申请人：Kabushiki Kaisha Toshiba
地址：1-1, Shibaura 1-Chome Minato-Ku Tokyo 105-8001 JP
国籍：JP
代理机构：Hoffmann Eitle
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