专利名称：Flip-chip semiconductor device with backside
contact
发明人：SCHAFFER, JOSEF-PAUL申请号：EP00106839.4申请日：20000330公开号：EP1139412A1公开日：20011004
专利附图：
摘要：The semiconducting component has a chip (1) with a front side (2) with at leastone chip connection with which the component can be attached to a carrier (8), wherebythe front side faces the carrier, and a rear side (3) opposite the front side. A contact
element (5) connected to the rear side of the chip over a large area has at least oneconnection element (6) attached to the carrier.
申请人：INFINEON TECHNOLOGIES AG
地址：St.-Martin-Strasse 53 811 München DE
国籍：DE
代理机构：Fischer, Volker, Dipl.-Ing.
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- huatuo6.com 版权所有 湘ICP备2023023988号-11
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务