专利名称：Method of manufacturing alignment mark发明人：Satoshi Machida,Akiyuki Minami申请号：US10034108申请日：20020103公开号：US06601314B2公开日：20030805
专利附图：
摘要：A method for manufacturing a highly reliable alignment mark in which by-products do not form at an aligning mark position during patterning. In this method, anintermediate layer is disposed on an upper layer of a first wiring to protect the firstwiring. Then, a filling material is coated thereon to fill in a through hole. Thereafter, a
plug is formed by etch-backing, and a second wiring is formed.
申请人：OKI ELECTRIC INDUSTRY CO, LTD.
代理机构：Rabin & Berdo, P.C.
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