ARRANGEMENT OF AT LEAST ONE HEAT-INSULATION LAYER

专利名称：ARRANGEMENT OF AT LEAST ONE HEAT-INSULATION LAYER ON A CARRIER BODY

发明人：BAST, ULRICH,ROSSNER, WOLFGANG申请号：EP04766342.2申请日：20040728公开号：EP1658480A1公开日：20060524

摘要：Said invention relates to an arrangement of at least one heat-insulation layer (3)for a carrier body (2) for preventing heat transfer between said carrier body and asurrounding area (7) therearound comprising at least one type of luminous substancewhich is excitable with the aid of an excitation light having a determined excitationwavelength for emitting a luminescent light having a defined emission wavelength and atleast one another heat-insulation layer (5) which is essentially free of said luminoussubstance. The inventive arrangement is characterised in that said another heat-insulationlayer is embodied in such a way that it is opaque with respect to the excitation light usedfor initiating the luminescent light emission and/or to a luminous substance light. Saidluminous substance contains at least one type of mixed oxide selected from a perovskitegroup of total formula AA'O3, and/or of pyrochlore of total formula A2B2O7, wherein Aand A' is the trivalent metal, respectively and B is a tetravalent metal. The inventive heat-insulation layer is preferably used for a gas turbine, the state thereof being easilycontrolled.

申请人：SIEMENS AKTIENGESELLSCHAFT

地址：Wittelsbacherplatz 2 80333 München DE

国籍：DE

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