Flip chip test structure

专利名称：Flip chip test structure发明人：Keeny Chang,Shelton Lu申请号：US10429845申请日：20030506公开号：US07141996B2公开日：20061128

专利附图：

摘要：A flip chip test structure is disclosed. The flip chip test structure utilizes asubstrate used in flip chip package to replace the conventional transformer of a flip chipwafer probe card. The substrate-transformer replacement reduces the cost andsimplifies the flip chip wafer probe card manufacturing process since the substrate is

already available and matches the chip being tested while the transformer needsadditional design and custom fabrication which are expensive and time-wasting forcorresponding chip being tested.

申请人：Keeny Chang,Shelton Lu

地址：Taipei TW,Taipei TW

国籍：TW,TW

代理机构：Rosenberg, Klein & Lee

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